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DXSG320
Double Disc Silicon Wafer Grinder.
High-speed and high-precision grinding with built-in motor type air spindles.
Grinding Capacity
O.D. (Min.~Max.)
[mm]
φ200 ~ φ300mm
I.D. (Min.~Max.)
[mm]
-
Thickness
[mm]
-
Grinding Wheel
O.D. (Min.~Max.)
[mm]
φ110 ~ φ160mm
I.D. (Min.~Max.)
[mm]
-
Width
[mm]
-
Floor Space
W x D
[mm]
1,900 x 2,560mm
Machine Weight
[Kg]
5,000Kg
